PXI Backplanes, Series LA 3U

Specifications:

  • PICMG 2.8 defines the pinout of the J2 connector for instrumentation systems based on CompactPCI

  • 3U, various slot counts available, electrical power via busbars/scews 

  • System slot left

  • Slot pitch 4 HP (20.32mm)

  • 33MHz

  • 3.3 and 5V I/O, 32 bit with and without rear I/O all slots

  • Shielded high-speed layout design guarantees optimal, synchronized timing and interference-free operation.  Outer layers designed as shielding areas

  • PCB material FR-4, UL recognized 94-VO, 2.8mm (.11” thick)

  • Conforms to PICMG 2.8 Specification

  • RoHS compliant

Features at a Glance:

  • Board design based on the HIGH-SPEED DESIGN concept.  Low reflection is achieved by means of uniform signal surge impedance
  • Design features an energy buffering feature which works across the entire frequency range.  This guarantees improved reliability due to more stable supply  voltages directly at each slot in conjunction with fluctuating loads
  • Continuous electrically conductive chassis GND surface located in the area where the backplane is mounted on the card rack.  An M3 screw connection is available to connect chassis ground. 

    By installing a connecting bracket or busbar, chassis GND can be connected to ground in a low-resistance star arrangement
  • Plug-in connectors for external connection of the JTAG and IPMB busses are standard
  • Main operating voltages are supplied via terminal bars/screws
  • For specific part numbers, download the Catalog sheet

 

Order Numbers
Description 

33 LA _ _ 1354

cPCI + PXI, 32-bit without rear I/O. 3.3V I/O

33 LA _ _ 1554

cPCI + PXI, 32-bit, without rear I/O, 5V I/O

33 LA _ _ 2354

cPCI + PXI, 32-bit with rear I/O. 3.3V I/O

33 LA _ _ 2554

cPCI + PXI, 32-bit, with rear I/O, 5V I/O

 _ _:  # pf slots (1 slot = 4 HP)


Custom Solutions:

Hartmann Electronic has been designing custom analog, digital, and mixed signal high-speed boards for over 35 years, with over 5,000 custom designs to date. Using state of the art design tools and fully automated production equipment, we provide custom solutions that fulfill the most exacting requirements with maximum packaging density.

Learn about our custom backplane capabilities